DeepSeek-V3.1 AI Model Launches with Domestic Chip Integration
DeepSeek-V3.1 AI Model Launches with Domestic Chip Integration
Beijing, August 26, 2025 - The artificial intelligence landscape has welcomed a significant advancement with the official release of the DeepSeek-V3.1 large language model. According to a Ping An Securities industry report, this new iteration introduces groundbreaking UE8M0FP8Scale parameter precision, substantially improving both tool utilization efficiency and agent performance across diverse applications.
Technical Advancements and Industry Impact
The DeepSeek-V3.1 represents a milestone in domestic AI development, particularly through its deep integration with China's chip manufacturing ecosystem. This strategic alignment between software and hardware promises to accelerate deployment across multiple sectors while fostering synergistic growth throughout the industrial chain.

"This isn't just about raw computational power," explains Dr. Wei Zhang, lead researcher at DeepSeek. "Our focus on parameter precision optimization allows for more efficient resource allocation without sacrificing performance - a crucial factor for real-world applications."
Complementary Product Launch: AutoGLM2.0
In parallel developments, Zhipu AI unveiled its AutoGLM2.0 mobile agent platform. This cloud-based solution boasts:
- Advanced cross-application autonomous execution capabilities
- Expanded API connectivity for smart hardware integration
- Enhanced adaptability for both personal and professional use cases
The simultaneous release of these technologies suggests coordinated progress across China's AI research institutions.
Market Response and Future Outlook
Financial markets have responded enthusiastically to these developments:
- Computer industry index rose 7.93% this week
- Sector P/E ratio reached 60.9x
- Broad-based gains across component stocks
Analysts interpret this as strong investor confidence in domestic AI capabilities and future commercialization potential.
Key Points:
- DeepSeek-V3.1 introduces novel parameter precision technology (UE8M0FP8Scale)
- Tight integration with domestic chips enhances practical deployment capabilities
- Zhipu's AutoGLM2.0 expands mobile agent functionality with cloud execution
- Financial markets show strong approval through sector-wide gains
- These developments signal China's growing competitiveness in global AI innovation

